Fast flip chip assembly for reel-to-reel manufacturing

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics

Volumn , Issue , 2001, Pages 319-323

  König, Martin ^a   Klink, Gerhard ^a   Feil, Michael ^a  

^a Fraunhofer Institute Reliability and Microintegration   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ANISOTROPY; ELECTRIC RESISTANCE; THERMAL CYCLING; THIN FILM CIRCUITS;

REEL-TO-REEL MANUFACTURING;

FLIP CHIP DEVICES;

EID: 0035790697     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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