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Is buried better? - Evaluation the performance of buried resistors in LTCCs
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Heiko Thust, Karl-heinz Drue, Torsten Thelemann, Erich K. Polzer, and Jens Muller, "Is Buried Better? -Evaluation the Performance of Buried Resistors in LTCCs," Advanced Packaging, March/April, pp. 40-46, 1998.
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A "killer app" for passive integration
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Omiya, Tokyo, April 19-21
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C.R.S. Needes, D.I. Amey, and S.J. Horowitz, "Cost Effective Solutions for High Density Interconnect and RF Moudles Using Low Temperature Cofired Ceramic Materials," Proceedings of the 2000 IEEE/IMC Symposium, Omiya, Tokyo, April 19-21, 2000.
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Evaluating the needs for integrated passive substrates
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Hemant Kapadia, Herb Cole, Rich Saia, and Kevin Durocher, "Evaluating the Needs for Integrated Passive Substrates," Advanced Microelectronics, pp. 14-17, January/February, 1999.
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Manufacture of embeded integrated passive components into low temperature cofired ceramic systems
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Chicago, Illinois, October 26-28
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Steve Scrantom, Greg Gravier, Ted Valentine, David Pehlke, and Brian Schiffer, "Manufacture of Embeded Integrated Passive Components into Low Temperature Cofired Ceramic Systems", Proceedings of the 1999 International Symposium on Microelectronics, Chicago, Illinois, October 26-28, pp. 459-466, 1999.
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February
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Kieran Denlaney, John Barrett, John Barton, and Rory Doyle, "Characterization and Performance Prediction for Integral Resistors in Low Temperature Cofired Ceramic technology," IEEE Transactions on Advanced Packaging, Vol. 22, No. 1, pp. 78-85, February, 1999.
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Effect of processing variables on cofired resistors in LTCCs
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Michael R. Ehlert, and Patricks S. Munoz, "Effect of Processing Variables on Cofired Resistors in LTCCs," HDI Magazine, pp. 64-69, July 1999.
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Chicago, Illinois, October 26-28
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A. Dziedzic, L.J. Golonka, M. Henke, J. Kita, H. Thust, K.-H. Drue, R. Bauer, L. Rebenklau, and K.-J. Wolter, "Electrical and Structural Characterization of Thick Film Resistors at Various LTCC Systems," Proceedings of the 1999 International Symposium on Microelectronics, IMAPS' 99, Chicago, Illinois, October 26-28, pp. 510-515, 1999.
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Embedded capacitors and resistors within low temperature co-fired ceramics on metal(dipak) packages for millimeter wave applications
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W.A. Vitriaol, D.A. Bates, R.J. Street, and W.P. Hautaniemi, "Embedded Capacitors and Resistors within Low Temperature Co-Fired Ceramics on Metal(DiPak) Packages for Millimeter Wave Applications," Proceedings of the 1999 International Conference on High Density Packaging and MCMs, pp. 420-424, 1999.
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Thick-film resistor design guidelines
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IHSM Professional Development Course, Chapter 5
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Characterization of thick film resistors up to 18 GHz for wireless and RF circuit applications
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Chicago, Illinois, October 26-28
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M.A. Jupina, C-Beyrouty, D.I. Amey, and A.T. Walker, "Characterization of Thick Film Resistors up to 18 GHz for Wireless and RF Circuit Applications", Proceedings of the 1999 International Symposium on Microelectronics, IMAPS' 99, Chicago, Illinois, October 26-28, pp. 510-515, 1999.
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