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Volumn 4587, Issue , 2001, Pages 325-331

Design and fabrication of embedded resistors in LTCC for high frequency applications

Author keywords

Embedded Resistor; Integrated Passives; LTCC; RF; Wireless

Indexed keywords

ASPECT RATIO; CERAMIC MATERIALS; ELECTRIC IMPEDANCE; ELECTRIC RESISTANCE MEASUREMENT; FIRING (OF MATERIALS); FITS AND TOLERANCES; INTEGRATED CIRCUITS; LOW TEMPERATURE EFFECTS; PASSIVE NETWORKS; RESISTORS;

EID: 0035770318     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (3)

References (18)
  • 1
    • 0003075192 scopus 로고    scopus 로고
    • RF & microwaves future trends
    • May/June
    • A. Elshabini, "RF&Microwaves Future Trends," Advancing Microeletronics, May/June, pp. 12-13, 1998.
    • (1998) Advancing Microeletronics , pp. 12-13
    • Elshabini, A.1
  • 4
    • 0010950049 scopus 로고    scopus 로고
    • Is buried better? - Evaluation the performance of buried resistors in LTCCs
    • March/April
    • Heiko Thust, Karl-heinz Drue, Torsten Thelemann, Erich K. Polzer, and Jens Muller, "Is Buried Better? -Evaluation the Performance of Buried Resistors in LTCCs," Advanced Packaging, March/April, pp. 40-46, 1998.
    • (1998) Advanced Packaging , pp. 40-46
    • Thust, H.1    Drue, K.-H.2    Thelemann, T.3    Polzer, E.K.4    Muller, J.5
  • 6
    • 0003283089 scopus 로고    scopus 로고
    • Cost effective solutions for high density interconnect and RF moudles using low temperature cofired ceramic materials
    • Omiya, Tokyo, April 19-21
    • C.R.S. Needes, D.I. Amey, and S.J. Horowitz, "Cost Effective Solutions for High Density Interconnect and RF Moudles Using Low Temperature Cofired Ceramic Materials," Proceedings of the 2000 IEEE/IMC Symposium, Omiya, Tokyo, April 19-21, 2000.
    • (2000) Proceedings of the 2000 IEEE/IMC Symposium
    • Needes, C.R.S.1    Amey, D.I.2    Horowitz, S.J.3
  • 7
    • 0032761443 scopus 로고    scopus 로고
    • Evaluating the needs for integrated passive substrates
    • January/February
    • Hemant Kapadia, Herb Cole, Rich Saia, and Kevin Durocher, "Evaluating the Needs for Integrated Passive Substrates," Advanced Microelectronics, pp. 14-17, January/February, 1999.
    • (1999) Advanced Microelectronics , pp. 14-17
    • Kapadia, H.1    Cole, H.2    Saia, R.3    Durocher, K.4
  • 9
    • 0002042526 scopus 로고    scopus 로고
    • Characterization and performance prediction for integral resistors in low temperature cofired ceramic technology
    • February
    • Kieran Denlaney, John Barrett, John Barton, and Rory Doyle, "Characterization and Performance Prediction for Integral Resistors in Low Temperature Cofired Ceramic technology," IEEE Transactions on Advanced Packaging, Vol. 22, No. 1, pp. 78-85, February, 1999.
    • (1999) IEEE Transactions on Advanced Packaging , vol.22 , Issue.1 , pp. 78-85
    • Denlaney, K.1    Barrett, J.2    Barton, J.3    Doyle, R.4
  • 11
    • 0011033753 scopus 로고    scopus 로고
    • Effect of processing variables on cofired resistors in LTCCs
    • July
    • Michael R. Ehlert, and Patricks S. Munoz, "Effect of Processing Variables on Cofired Resistors in LTCCs," HDI Magazine, pp. 64-69, July 1999.
    • (1999) HDI Magazine , pp. 64-69
    • Ehlert, M.R.1    Munoz, P.S.2
  • 16
    • 0011003034 scopus 로고    scopus 로고
    • Design of thick film resistor
    • IHSM Professional Development Course, Chapter 5
    • Jerry E. Sergent, and Aicha Elshabini, "Design of Thick Film Resistor" in Fundamentals of Hybrid Microelectronics, IHSM Professional Development Course, Chapter 5, pp. 75-90.
    • Fundamentals of Hybrid Microelectronics , pp. 75-90
    • Sergent, J.E.1    Elshabini, A.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.