Is buried better? Evaluating the performance of buried resistors in LTCCs

Advanced Packaging

Volumn 7, Issue 3, 1998, Pages 40-46

  Thust, Heiko ^a   Drue, Karl Heinz ^a   Thelemann, Torsten ^a   Polzer, Erich K ^b   Müller, Jens ^c  

^a ILMENAU UNIVERSITY OF TECHNOLOGY   (Germany)

^b DuPont de Nemours GmbH   (Germany)

^c MSE Micro Systems Engineering GmbH & Co   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0010950049     PISSN: 10650555     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (4)

1. E. Polzer, "Vergrabene Bauelemente - neue Möglichkeit der Schaltungsrealisierung," Proceedings of the SMT/ES&S/Hybrid Symposium, Nuremberg, May 1996.
2. T. Tobita, H. Takasago and K. Kariya, "Investigation of the Conduction Mechanism in Thick Film Resistors Trimmed by the Pulse Voltage Method," IEEE Transactions on Components, Hybrids and Manufacturing Technology, Vol. 15, No. 4, Aug. 1992.
3. T. Tobita and H. Takasago, "New Trimming Technology of a Thick Film Resistor by the Pulse Voltage Method," IEEE Transactions on Components, Hybrids and Manufacturing Technology, Vol. 14, No. 3, Sept. 1991.
4. J. Müller et al., "Trimming of Buried Resistors in LTCC-Circuits," Proceedings of the ISHM Nordic, Sept. 1996.