-
1
-
-
0001248896
-
-
Zapka, W., Ziemlich, W. and Tam, A.C., Appl. Phys. Lett. 58, 2217 (1991).
-
(1991)
Appl. Phys. Lett.
, vol.58
, pp. 2217
-
-
Zapka, W.1
Ziemlich, W.2
Tam, A.C.3
-
2
-
-
36448999056
-
-
Tam, A.C., Leung, W.P., Zapka, W. and Ziemlich, W., J. Appl. Phys. 71, 3515 (1992).
-
(1992)
J. Appl. Phys.
, vol.71
, pp. 3515
-
-
Tam, A.C.1
Leung, W.P.2
Zapka, W.3
Ziemlich, W.4
-
3
-
-
0025800742
-
-
Kelley, J.D., Stuff, M.I., Hovis, F.E. and Linford, G.J., SPIE Proc. 1415, 211 (1991).
-
(1991)
SPIE Proc.
, vol.1415
, pp. 211
-
-
Kelley, J.D.1
Stuff, M.I.2
Hovis, F.E.3
Linford, G.J.4
-
4
-
-
0342763375
-
-
Heroux, J.B., Boughaba, S., Ressejac, I., Sacher, E. and Meunier, M., J. Appl. Phys. 79, 2857 (1996).
-
(1996)
J. Appl. Phys.
, vol.79
, pp. 2857
-
-
Heroux, J.B.1
Boughaba, S.2
Ressejac, I.3
Sacher, E.4
Meunier, M.5
-
5
-
-
0030642943
-
-
Boughaba, S., Wu, X., Sacher, E. and Meunier, M., J. Adhesion 61, 293 (1997).
-
(1997)
J. Adhesion
, vol.61
, pp. 293
-
-
Boughaba, S.1
Wu, X.2
Sacher, E.3
Meunier, M.4
-
6
-
-
0010669430
-
-
Blacksburg, VA
-
Wu, X., Sacher, E. and Meunier, M., Proc. 21th Annu. Mtg. Adhesion Soc. (Blacksburg, VA, 1998), p. 309.
-
(1998)
Proc. 21th Annu. Mtg. Adhesion Soc.
, pp. 309
-
-
Wu, X.1
Sacher, E.2
Meunier, M.3
-
7
-
-
0032660954
-
-
Wu, X., Sacher, E. and Meunier, M., J. Adhesion 70, 167 (1999).
-
(1999)
J. Adhesion
, vol.70
, pp. 167
-
-
Wu, X.1
Sacher, E.2
Meunier, M.3
-
8
-
-
0001535157
-
-
Wu, X., Sacher, E. and Meunier, M., J. Appl. Phys. 86, 1744 (1999).
-
(1999)
J. Appl. Phys.
, vol.86
, pp. 1744
-
-
Wu, X.1
Sacher, E.2
Meunier, M.3
-
9
-
-
0001627604
-
-
Wu, X., Sacher, E. and Meunier, M., J. Appl. Phys. 87, 3618 (2000).
-
(2000)
J. Appl. Phys.
, vol.87
, pp. 3618
-
-
Wu, X.1
Sacher, E.2
Meunier, M.3
-
10
-
-
85036933833
-
-
U.S. patents 5 024 968 and 5 099 557
-
Engelsberg, A.C., U.S. patents 5 024 968 and 5 099 557.
-
-
-
Engelsberg, A.C.1
-
12
-
-
0010715002
-
-
Kern, W. Ed. (Noyes Publications, Park Ridge, New Jersey)
-
Donovan, R.P. and Menon, V.B., In: Handbook of Semiconductor Wafer Cleaning Technology, Kern, W. Ed. (Noyes Publications, Park Ridge, New Jersey, 1993), pp. 164-167.
-
(1993)
Handbook of Semiconductor Wafer Cleaning Technology
, pp. 164-167
-
-
Donovan, R.P.1
Menon, V.B.2
-
13
-
-
0027795355
-
-
Donovan, R.P., Yamamoto, T. and Periasamy, R., Mat. Res. Soc. Symp. Proc. 315, 3 (1993).
-
(1993)
Mat. Res. Soc. Symp. Proc.
, vol.315
, pp. 3
-
-
Donovan, R.P.1
Yamamoto, T.2
Periasamy, R.3
-
14
-
-
0025746075
-
-
Ye, Y., Pui, D.Y., Lui, B.Y.H., Opiolka, S., Blumhorst, S. and Fissan, H., J. Aerosol Sci. 22, 63 (1991).
-
(1991)
J. Aerosol Sci.
, vol.22
, pp. 63
-
-
Ye, Y.1
Pui, D.Y.2
Lui, B.Y.H.3
Opiolka, S.4
Blumhorst, S.5
Fissan, H.6
-
20
-
-
0003577140
-
-
J. Wiley, New York
-
Hinds, W.C., Aerosol Technology: Properties, Behavoir, and Measurement of Airborne Particles (J. Wiley, New York, 1999), pp. 171 - 174.
-
(1999)
Aerosol Technology: Properties, Behavoir, and Measurement of Airborne Particles
, pp. 171-174
-
-
Hinds, W.C.1
-
21
-
-
0003986037
-
-
Addison-Wesley Publishing Co., Reading, Massachusetts, Menlo Park, California
-
Sears, F.W., Zemansky, M.W. and Young, H.D., College Physics (Addison-Wesley Publishing Co., Reading, Massachusetts, Menlo Park, California, 1982), p. 254.
-
(1982)
College Physics
, pp. 254
-
-
Sears, F.W.1
Zemansky, M.W.2
Young, H.D.3
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