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Volumn 61, Issue 1-4, 1997, Pages 293-307

Liquid explosive evaporative removal of submicron particles from hydrophilic oxidized silicon surfaces

Author keywords

Adhesion; Contamination; Hydrophilic silicon surface; Laser cleaning; Liquid explosive evaporation; Particle removal

Indexed keywords

ALUMINA; CARBON DIOXIDE LASERS; EVAPORATION; IMPURITIES; LASER APPLICATIONS; LASER BEAM EFFECTS; LASER PULSES; OXIDATION; POLYSTYRENES; SILICA; SILICON; WATER;

EID: 0030642943     PISSN: 00218464     EISSN: None     Source Type: Journal    
DOI: 10.1080/00218469708010527     Document Type: Article
Times cited : (8)

References (21)
  • 2
    • 0005242457 scopus 로고
    • Kern, W., Ed. Noyes Publications, Park Ridge, N. J.
    • Kern, W., in Handbook of Semiconductor Wafer Cleaning, Kern, W., Ed. (Noyes Publications, Park Ridge, N. J., 1993), p. 3 and p. 595.
    • (1993) Handbook of Semiconductor Wafer Cleaning , pp. 3
    • Kern, W.1
  • 12
    • 0027795363 scopus 로고
    • Surfaces Chemical Cleaning and Passivation for Semiconductor Processing, Higashi, O.S., Irene, E. A. and Ohmi, T., Ed. Mater. Res. Soc., Pittsburgh, PA
    • Engelsberg, A. C., in Surfaces Chemical Cleaning and Passivation for Semiconductor Processing, Mater. Res. Soc. Proc., Vol. 315, Higashi, O.S., Irene, E. A. and Ohmi, T., Ed. (Mater. Res. Soc., Pittsburgh, PA, 1993), p. 255.
    • (1993) Mater. Res. Soc. Proc. , vol.315 , pp. 255
    • Engelsberg, A.C.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.