Transfer of thin epitaxial silicon films by wafer bonding and splitting of double layered porous silicon for SOI fabrication

Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors

Volumn 22, Issue 12, 2001, Pages 1501-1506

  Zhu, Shi Yang ^a   Li, Ai Zhen ^a   Huang, Yi Ping ^a  

^a FUDAN UNIVERSITY   (China)

Author keywords

Porous silicon; Silicon epitaxy; SOI; Wafer bonding

Indexed keywords

BONDING; EPITAXIAL GROWTH; HEAT TREATMENT; SEMICONDUCTING FILMS; SEMICONDUCTOR DEVICE TESTING;

DOUBLE LAYERED POROUS SILICON; EPITAXIAL SILICON FILMS; WAFER BONDING;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0035740853     PISSN: 02534177     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (12)