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Volumn 673, Issue , 2001, Pages
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"Reverse" stress relaxation in Cu thin films
a a a a a |
Author keywords
[No Author keywords available]
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Indexed keywords
COPPER;
CREEP;
METALLOGRAPHIC MICROSTRUCTURE;
PLASTIC DEFORMATION;
RESIDUAL STRESSES;
SPUTTERING;
STRAIN;
STRESS RELAXATION;
TEMPERATURE;
TENSILE STRESS;
THIN FILMS;
CONTROLLED GAS PRESSURE BULGING;
PLASTIC STRAINING;
RESONANCE FREQUENCY MEASUREMENT;
REVERSE STRESS RELAXATION;
SUBSTRATE CURVATURE MEASUREMENT;
METALLIC FILMS;
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EID: 0035559711
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1557/proc-673-p1.4 Document Type: Conference Paper |
Times cited : (9)
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References (13)
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