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Volumn 673, Issue , 2001, Pages

"Reverse" stress relaxation in Cu thin films

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CREEP; METALLOGRAPHIC MICROSTRUCTURE; PLASTIC DEFORMATION; RESIDUAL STRESSES; SPUTTERING; STRAIN; STRESS RELAXATION; TEMPERATURE; TENSILE STRESS; THIN FILMS;

EID: 0035559711     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-673-p1.4     Document Type: Conference Paper
Times cited : (9)

References (13)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.