Effects of particle concentration in CMP

Materials Research Society Symposium - Proceedings

Volumn 671, Issue , 2001, Pages

  Choi, Wonseop ^a   Lee, Seung Mahn ^a   Singh, Rajiv K ^a  

^a J Crayton Pruitt Family Department of Biomedical Engineering   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION EFFECTS; DYNAMICS; FORCE MEASUREMENT; FRICTION; INTERFACES (MATERIALS); PARTICLES (PARTICULATE MATTER); SURFACE PROPERTIES; SURFACE ROUGHNESS;

DYNAMIC FRICTION FORCE; LATERAL FRICTION FORCES; PARTICLE CONCENTRATION; SURFACE COVERAGE; WAFER-PAD-SLURRY INTERACTIONS;

CHEMICAL MECHANICAL POLISHING;

EID: 0035558745     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-671-m5.1     Document Type: Conference Paper

References (9)