Characterization of iodoheptafluoropropane as a dielectric etchant. III. Effluent analysis

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 19, Issue 4, 2001, Pages 1306-1318

  Karecki, Simon ^a   Chatterjee, Ritwik ^a   Pruette, Laura ^a   Reif, Rafael ^a   Vartanian, Victor ^b   Sparks, Terry ^b   Beu, Laurie ^b  

^a Massachusetts Institute of Technology Cambridge   (United States)

^b MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION; DIELECTRIC FILMS; EFFLUENTS; FOURIER TRANSFORM INFRARED SPECTROSCOPY; HYDROGEN; IODINE; ION BOMBARDMENT; ISOMERS; PLASMA ETCHING; REACTION KINETICS; SILICON WAFERS; SUBSTITUTION REACTIONS;

DIELECTRIC ETCH; EFFLUENT ANALYSIS; INDUCTIVELY COUPLED HIGH DENSITY PLASMA; IODOHEPRAFLUOROPROPANE; PERFLUOROCOMPOUND CHEMISTRIES;

FLUORINE CONTAINING POLYMERS;

EID: 0035535260     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1387080     Document Type: Conference Paper

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