Use of 2H-heptafluoropropane, 1-iodoheptafluoropropane, and 2-iodoheptafluoropropane for a high aspect ratio via etch in a high density plasma etch tool

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 16, Issue 4, 1998, Pages 2722-2724

  Karecki, Simon ^a   Pruette, Laura ^a   Reif, Rafael ^a   Beu, Laurie ^b   Sparks, Terry ^b   Vartanian, Victor ^b  

^a Massachusetts Institute of Technology Cambridge   (United States)

^b MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0032349752     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.581415     Document Type: Article

References (6)

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2. S. M. Karecki, L. C. Pruette, and L. R. Reif, Mater. Res. Soc. Symp. Proc. 447, 67 (1997).
3. S. Karecki, L. Pruette, and R. Reif, J. Vac. Sci. Technol. (submitted).
4. V. Mohindra, H. H. Sawin, M. T. Mocella, J. M. Cook, J. Flanner, and O. Turmel, Proc. Electrochem. Soc. PV94-20, 300 (1994).
5. S. Soggs, B. Bryant, B. A. Breck, S. Rogers, R. Vritis, and L. Mendicino, Proceedings from the SEMI Technical Program: A Partnership for PFC Emissions Reduction, Austin, TX, 1996, pp. 71-80.
6. F. Fracassi, R. d'Augustino, M. Stenardo, L. R. Atzei, and F. Illuzzi, Proceedings of the Fourth International ESH Conference, Milan, Italy, 1997, Vol. 1.