SCOPUS 정보 검색 플랫폼

IEEE Transactions on Semiconductor Manufacturing

Volumn 14, Issue 4, 2001, Pages 365-371

Comparison of novel cleaning solutions with various chelating agents for post-CMP cleaning on poly-Si film

(7) Pan, Tung Ming a Lei, Tan Fu a Ko, Fu Hsiang b Chao, Tien Sheng b Chiu, Tzu Huan a Lee, Ying Hao c Lu, Chih Peng c

a NATIONAL CHIAO TUNG UNIVERSITY (Taiwan)

b NATIONAL NANO DEVICE LABORATORIES (Taiwan)

c Merck Kanto Advanced Chemicals Ltd (Taiwan)

Author keywords

Chelating agents; Citric acid; CMP; EDTA; Oxalic acid; Particles and metallic impurities; TMAH

Indexed keywords

ACIDS; AGENTS; CHELATION; CHEMICAL MECHANICAL POLISHING; IMPURITIES; POLYSILICON; SURFACE CLEANING;

AMMONIUM HYDROXIDE ALKALINE SOLUTION; CARBOXYL ACID GROUP; CHELATING AGENTS; CITRIC ACID; ETHYLENEDIAMINITETRAACETIC ACID; METALLIC IMPURITIES; OXALIC ACID; TETRAMETHYLAMMONIUM HYDROXIDE;

SEMICONDUCTING FILMS;

EID: 0035507394 PISSN: 08946507 EISSN: None Source Type: Journal
DOI: 10.1109/66.964323 Document Type: Article

Times cited : (18)

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