Packaging using microelectromechanical technologies and planar components

IEEE Transactions on Microwave Theory and Techniques

Volumn 49, Issue 11, 2001, Pages 2099-2104

  Takahashi, Kazuaki ^a   Sangawa, Ushio ^a   Fujita, Suguru ^a   Matsuo, Michiaki ^a   Urabe, Takeharu ^b   Ogura, Hiroshi ^b   Yabuki, Hiroyuki ^a  

^a Matsushita Research Institute Tokyo Inc   (Japan)

^b PANASONIC CORPORATION   (Japan)

Author keywords

BCB; Flip chip; Inverted microstrip; Micromachining; Silicon; Suspended line

Indexed keywords

INVERTED MICROSTRIP LINE; LOW LOSS PLANAR FILTER; MICROELECTROMECHANICAL TECHNOLOGIES; MILLIMETER WAVE PACKAGING STRUCTURE; MULTILAYERED BENZOCYCLOBUTENE; POLE CONTROL TECHNIQUE; SILICON SUBSTRATE;

ANTENNAS; ATTENUATION; FLIP CHIP DEVICES; MICROELECTROMECHANICAL DEVICES; MILLIMETER WAVE DEVICES; MULTILAYERS; RADIO COMMUNICATION; RESONATORS; SEMICONDUCTING SILICON; SEMICONDUCTOR DEVICE STRUCTURES; SOLDERING; SUBSTRATES;

ELECTRONICS PACKAGING;

EID: 0035506182     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.963143     Document Type: Article

References (10)

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