Millimeter-wave transceiver MCM usig multi-layer BCB with integrated planner antenna

1999 29th European Microwave Conference, EuMC 1999

Volumn 1, Issue , 1999, Pages 91-94

  Fujita, Suguru ^a   Sangawa, Ushio ^a   Takahashi, Kazuaki ^a   Goho, Kenji ^a   Takeyama, Shigeru ^a   Ogura, Hiroshi ^a   Yabuki, Hiroyuki ^a  

^a Matsushita Research Institute Tokyo Inc   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ANTENNA ARRAYS; FLIP CHIP DEVICES; MILLIMETER WAVES; SLOT ANTENNAS; SUBSTRATES; TRANSCEIVERS;

FLIP CHIP; GLASS SUBSTRATES; INDEPENDENT FUNCTIONS; KA BAND; THREE-LAYER;

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 0002329646     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EUMA.1999.338348     Document Type: Conference Paper

References (9)

1. Smith P.M. et al. "Status of InP HEMT technology for microwave receiver applications," IEEE 1996 MTT-S Digest, pp. 5-8,1996
2. L. Tran et al. "High performance, high yield millimeter-wave MMIC LNAs using InP HEMTs," IEEE 1996 MTT-S Digest, pp. 9-12,1996.
3. H. Sakai et al., "A millimeter-wave flip-chip IC using micro bump bonding technology," 1996 IEEE ISSCC Digest, pp. 408-409, 1996.
4. K. Takahashi et al., "An advanced miillimeter-wave flip-chip IC integrating different kinds of active devices," 1996 IEEE MTT-S Symp. Digest, pp. 1919-1922, 1996.
5. K. Takahashi et al., 'Millimeter-wave Circutit Technology Applying Flip-chip Bonding," MWE96 Digest, pp.180-185, 1996.
6. K. Takahashi et al., "Devcpmet of K-Band Fron-End Devices for BiwdhsmflMrdem Communkation Systems using Millimeter-Wave Flip-Chip IC Teching," IECE Tranm on Electnixcs, Vol. E81-C No. 6, pp. 827-833, Junee 1998
7. U. Sangawa et al., "Micromachined Mllimeter-wave Devices with Three Dimensional Structure," 1998 Asia-Pacific Microwave Conference Proceedings, Vol. 2, pp. 505-508, 1998.
8. K. Takahashi et al., "K-band Receiver Front-End IC Integrating Micromachined Filter and Flip-chip Assembled Active Devices," 1999 IEEE MTT-S Symp. Digest, pp. 229-232, 1999.
9. K. Takahashi et al., "K-band Receiver Front-End IC Integrating Micromachined Filter and Flip-chip Assembled Active Devices," 1999 IEEE MTT-S Symp. Digest, pp. 229-232, 1999.