New olefinic interlevel dielectric materials for multi-chip modules

Proceedings of the IEEE Multi-Chip Module Conference

Volumn , Issue , 1996, Pages 182-187

  Shick, R A ^a   Goodall, B L ^a   McIntosh, L H ^a   Jayaraman, S ^a   Kohl, P A ^a   Bidstrup Allen, S A ^a   Grove, N R ^a  

^a BFGoodrich   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COPPER; ELECTRIC RESISTANCE; GOLD; MICROELECTRONICS; MULTICHIP MODULES; PERMITTIVITY; POLYOLEFINS; SEMICONDUCTOR DEVICE MANUFACTURE; SILVER;

ELONGATION TO BREAK; INTERCONNECTION DENSITY; LOW MOISTURE ABSORPTION; ROUTING DENSITY;

DIELECTRIC MATERIALS;

EID: 0029733735     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)