Process characterization for tapered contact etch

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 19, Issue 5, 2001, Pages 1845-1851

  Celii, F G ^a   He, Q ^a   Liu, H Y ^a   DeBord, J R ^a   Sakima, H ^b  

^a TEXAS INSTRUMENTS   (United States)

^b TOKYO ELECTRON AMERICA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ETCHING; PHOTORESISTORS; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; STATIC RANDOM ACCESS STORAGE; TRANSMISSION ELECTRON MICROSCOPY; X RAY PHOTOELECTRON SPECTROSCOPY;

TAPER ETCH PROCESSES;

ANTIREFLECTION COATINGS;

EID: 0035440743     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1401745     Document Type: Article

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