Mechanical integrity failure of bulk-micromachined Si wafers: Influence of structure geometry and wafer handling

ASDAM 2000 - Conference Proceedings: 3rd International EuroConference on Advanced Semiconductor Devices and Microsystems

Volumn , Issue , 2000, Pages 227-230

  Bartek, M ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

FAILURE (MECHANICAL); GEOMETRY; MECHANICAL STABILITY; MICROSYSTEMS; SEMICONDUCTOR DEVICES;

BULK-MICROMACHINED; FABRICATION SEQUENCE; GEOMETRY PARAMETER; MECHANICAL INTEGRITY; MECHANICAL LOADS; MEMBRANE THICKNESS; STRUCTURE GEOMETRY; WAFER HANDLING;

SILICON WAFERS;

EID: 67650296207     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ASDAM.2000.889486     Document Type: Conference Paper

References (5)

1. F. Ericson and J. A. Schweitz. J. Appl. Phys. 68,1990, pp. 5840-5844.
2. T. Lisby, S. Nikles, K. Najafi, O. Hansen, S. Bouwstra and J. Branebjerg, in Proceedings of Eurosensors XIV, Copenhagen, Denmark, 2000, pp. 279-282.
3. C.J. Wilson and P.A. Beck, J. Micromechanical Systems 5, 3, 1996, pp. 142-150.
4. J.M. Gere and S. Timoshenko, Mechanics of materials, Stanley Thornes Publishers, Cheltenham, 1998.
5. M. Bartek, Z. Xiao, C. van Müllem and R.F. Wolffenbuttel, in Proc. MME'2000, October 1-3, 2000, Uppsala, Sweden.