The investigation of microsystems using Raman spectroscopy

Optics and Lasers in Engineering

Volumn 36, Issue 2, 2001, Pages 213-223

  De Wolf, Ingrid ^a   Jian, Chen ^a   Van Spengen, W Merlijn ^a  

^a IMEC   (Belgium)

Author keywords

MEMS; Micro Raman spectroscopy; Packaging; Stress

Indexed keywords

ELECTRONICS PACKAGING; IMAGING TECHNIQUES; NONDESTRUCTIVE EXAMINATION; RAMAN SPECTROSCOPY; STRESS ANALYSIS;

SPATIAL RESOLUTIONS;

MICROELECTROMECHANICAL DEVICES;

EID: 0035424690     PISSN: 01438166     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0143-8166(01)00033-1     Document Type: Article

References (11)

1. Micro nano technology visualization (MNTV) of micromachined MEMS polysilicon structures
2. Raman scattering in silicon and germanium
3. Performance of ultra hard carbon wear coatings on microgears fabricated by LIGA
4. Topical review: Micro-Raman spectroscopy to study local mechanical stress in silicon integrated circuits
5. Stress measurements in Si microelectronics devices using Raman spectroscopy
6. Experimental two-dimensional mechanical stress characterization in a silicon pressure sensor membrane using micro-Raman spectroscopy
7. Local stress measurements in packaging by Raman spectroscopy