The optical measurement station for complex testing of microelements

Optics and Lasers in Engineering

Volumn 36, Issue 2, 2001, Pages 225-240

  Sałbut, Leszek ^a   Kujawińska, Małgorzata ^a  

^a WARSAW UNIVERSITY OF TECHNOLOGY   (Poland)

Author keywords

Digital holographic interferometry; ESPI; Grating interferometry; Interferometry; MEMS; Microelements and electronic packaging testing; Micromechanics; Thermovision

Indexed keywords

ELECTRONICS PACKAGING; HOLOGRAPHIC INTERFEROMETRY; INTERFEROMETERS; OPTICAL WAVEGUIDES; VIBRATIONS (MECHANICAL);

GRATING INTERFEROMETRY; OPTICAL MEASUREMENTS;

MICROELECTROMECHANICAL DEVICES;

EID: 0035423947     PISSN: 01438166     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0143-8166(01)00032-X     Document Type: Article

References (13)

1. Developments in micromechanics through analysis and experimentation
2. Micromeasurements: A challenge for photomechanics
3. Combined measurement of silicon microbeams by grating interferometry and digital holography
4. Selection of interferometric methods for silicon microelements testing
5. Novel aspects of interferometric testing of silicon microelements properties
6. Measuring shape and deformation of small object wing digital holography
7. Waveguide grating (moiré) microinterferometer for in-plane displacement/strain fields investigation
8. New generation of optical extensometer based on grating (moiré) interferometry
9. Moiré interferometry/termovision method for electronic packages testing
10. High sensitivity moiré interferometry with compact achromatic interferometer
11. Grating microinterferometer for local in-plane displacement/strain field analysis