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Volumn , Issue , 1996, Pages 1232-1238
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TSOP solder joint reliability
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Author keywords
[No Author keywords available]
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Indexed keywords
CRACK PROPAGATION;
DATA REDUCTION;
DATABASE SYSTEMS;
FAILURE ANALYSIS;
FATIGUE TESTING;
MATHEMATICAL MODELS;
RELIABILITY;
SOLDERED JOINTS;
SOLDERING ALLOYS;
THERMAL CYCLING;
ACCELERATION FACTOR;
ENGELMAIER FORMULA;
NORRIS-LANDZBURG FORMULA;
SOLDER JOINT RELIABILITY;
TEMPERATURE PROFILES;
THERMAL CYCLING TESTS;
THERMAL FATIGUE LIFE;
THIN SMALL OUTLINE PACKAGE;
ELECTRONICS PACKAGING;
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EID: 0029710626
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Article |
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Times cited : (10)
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References (0)
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