Effect of mold compounds on warpage in LOC package

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 1196-1200

  Ko, Minjin ^a   Shin, Dongsuk ^a   Moon, Myungsun ^a   Lee, Inhee ^a   Park, Yongjoon ^a   Jung, Youngkyu ^a   Song, Chijoong ^a  

^a LG Chemical Ltd   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING STRENGTH; CURING; DYNAMIC RANDOM ACCESS STORAGE; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; MICROPROCESSOR CHIPS; OPTIMIZATION; PLASTICS FILLERS; RESINS;

CURE RATE; LEAD ON CHIP; PACKAGE PLANARITY; WARPAGE;

SHEET MOLDING COMPOUNDS;

EID: 0032676508     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (8)