A new approach to the dynamic thermal modelling of semiconductor packages

Microelectronics Reliability

Volumn 41, Issue 6, 2001, Pages 901-912

  Masana, F N ^a  

^a UNIVERSITAT POLITÈCNICA DE CATALUNYA   (Spain)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; HEAT RESISTANCE; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICE MODELS; SPECIFIC HEAT;

DYNAMIC THERMAL MODELING;

ELECTRONICS PACKAGING;

EID: 0035368035     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(01)00013-0     Document Type: Article

References (16)

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4. On the representation of infinite-length distributed RC one-ports
5. Analysis of thermal transient data with synthesised dynamic models for semiconductor devices
6. Identification of RC networks by deconvolution: Chances and limits
7. Thermal resistance analysis by induced transient (TRAIT) method for power electronic devices thermal characterization - Part I: Fundamentals and theory
8. Thermal resistance analysis by induced transient (TRAIT) method for power electronic devices thermal characterization - Part II: Practice and experiments
9. Closed form solution of junction to substrate thermal resistance in semiconductor chips
10. Closed form thermal resistance calculation for different sets of boundary conditions
11. Thermal resistance calculation in multilayer substrates
12. Thermal characterisation of power modules
13. Static and dynamic thermal modeling of smartpack package
14. A new evaluation method of thermal transient measurement results
15. Dynamic thermal characterization and modeling of packaged AlGaAs/GaAs HBTs