Thermal characterisation of power modules

Microelectronics Reliability

Volumn 40, Issue 1, 2000, Pages 155-161

  Masana, F N ^a  

^a UNIVERSITAT POLITÈCNICA DE CATALUNYA   (Spain)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL METHODS; HEAT RESISTANCE; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; OPTIMIZATION; THERMOANALYSIS;

POWER MODULES;

POWER ELECTRONICS;

EID: 0033899832     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0026-2714(99)00151-1     Document Type: Article

References (9)

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9. SmartPack is a registered Trademark of SamrtPack Tecnologia S.A. under Patent no. P9302702.