Effect of out-of-plane material behavior on in-plane modeling

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 1998, Pages 256-262

  Manjula, S ^a   Sitaraman, Suresh K ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; DEFORMATION; MATHEMATICAL MODELS; STRAIN; STRESSES; THERMAL EXPANSION; THREE DIMENSIONAL; TWO DIMENSIONAL;

CLOSED FORM ANALYSIS; COEFFICIENT OF THERMAL EXPANSION; THERMOMECHANICAL ANALYSIS;

ELECTRONICS PACKAGING;

EID: 0031624414     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)