New materials for active and passive integrated devices for wireless applications

Microelectronic Engineering

Volumn 56, Issue 1-2, 2001, Pages 169-175

  Gill, P ^a   Miller, M ^a   Nguyen, B Y ^a  

^a MOTOROLA INC   (United States)

Author keywords

High permittivity materials solutions; Integrated circuit; Wireless applications

Indexed keywords

CELLULAR TELEPHONE SYSTEMS; CMOS INTEGRATED CIRCUITS; ELECTRONIC COMMERCE; LEAKAGE CURRENTS; PERMITTIVITY; WIRELESS TELECOMMUNICATION SYSTEMS; WORLD WIDE WEB;

SYSTEM-ON-A-CHIP INTEGRATION;

MICROELECTRONICS;

EID: 0035341561     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(00)00522-0     Document Type: Article

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