Time domain modeling of lossy interconnects

IEEE Transactions on Advanced Packaging

Volumn 24, Issue 2, 2001, Pages 191-196

  Svensson, Christer ^a,b   Dermer, Gregory E ^c  

^a IEEE   (Sweden)

^b LINKÖPING UNIVERSITY   (Sweden)

^c INTEL CORPORATION   (United States)

Author keywords

Dielectric loss; Interconnect; Maximum data rates; Printed circuit boards; Time domain model; Transmission line

Indexed keywords

LOSSY INTERCONNECTS;

DIELECTRIC LOSSES; ELECTRIC LINES; FOURIER TRANSFORMS; INTERCONNECTION NETWORKS; RELAXATION PROCESSES; SKIN EFFECT; TIME DOMAIN ANALYSIS; TRANSFER FUNCTIONS;

PRINTED CIRCUIT BOARDS;

EID: 0035329211     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.928754     Document Type: Article

References (11)

1. Limit to the bit-rate capacity of electrical interconnects from the aspect ratio of the system architecture
2. On the modeling of conductor and substrate losses in multiconductor, multidielectric transmission line systems
3. A universal model for lossy and dispersive transmission lines for time domain CAD of circuits
4. Including dielectric loss in printed circuit models for improved EMI/EMC predictions
5. Dielectric properties of polymers at microwave frequencies: A review
6. Tests characterize high-frequency material properties
7. High frequency loss and electromagnetic field distribution for striplines and microstrips