Low-thermal-expansion copper composites via negative cte metallic elements

JOM

Volumn 50, Issue 6, 1998, Pages 70-72

  Mavoori, H ^a,b,c   Jin, S ^b,c,d  

^a NORTHWESTERN UNIVERSITY   (United States)

^b LUCENT TECHNOLOGIES   (United States)

^c TMS   (United States)

^d UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTRONICS PACKAGING; HEAT SINKS; NICKEL ALLOYS; TEMPERATURE CONTROL; THERMAL EXPANSION;

THERMAL EXPANSION COEFFICIENTS; THERMAL EXPANSION MISMATCH; THERMAL MANAGEMENT;

COMPOSITE MATERIALS;

EID: 0032097240     PISSN: 10474838     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11837-998-0133-9     Document Type: Article

References (12)

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