Thick-film technology offers high packaging density

Microwaves and RF

Volumn 38, Issue 2, 1999, Pages 77-86

  Skurski, Michael A ^a   Smith, Michael A ^a   Draudt, Richard R ^a   Amey, Daniel I ^a   Horowitz, Samuel J ^a   Champ, Michael J ^a  

^a DUPONT COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0005781877     PISSN: 07452993     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (13)

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2. Defense Advanced Research Projects Agency (DARPA), "Low-Cost Packaging For Wireless Communications in a Global Market," TRP Contract 5114.
3. R.R. Tummala and E.J. Rymaszewski, Microelectronic Packaging Handbook, Van Nostrand, New York, NY, 1989, pp. 501-511.
4. David L. Wilcox Sr., Rong Fong Huang, and Dean Anderson, "The Ceramic Integrated Circuit (MCIC) Technology: Opportunities and Challenges," Proceedings of the International Symposium on Microelectronics, Philadelphia, PA, October 1997, pp. 17-23.
5. J. Estes, R. Kommrusch, and R.F. Huang, "Integration of a Receiver Front End in Multilayer Ceramic Integrated Circuit Technology," Proceedings of the Wireless Communications Conference, Boulder CO, August 1997.
6. Michael O'Hearn, "Designing a Frequency-Synthesizer Module Using Low-Temperature Cofired Ceramic," RF Design, November 1996, pp. 46-52.
7. Daniel I. Amey and Samuel J. Horowitz, "Tests Characterize High-Frequency Material Properties," Microwaves & RF, August 1997, pp. 68-80.
8. T.R. Suess and M.A. Skurski, "Fodel®, Photoprintable Thick Film; Materials and Processing," Proceedings of 21st Annual ISHM Meeting, New England, April 1994.
9. J.J. Felten and M.A. Skurski, "Fodel and Diffusion Patterning™ for High-Density Multilayer and Packaging: Materials and Processing," American Ceramic Society, Cincinnati, OH, May 1998.
10. J.P. Cazenave and T.R. Suess, "Fodel®, Photoimageable Materials - A Thick-Film Solution for High-Density Multichip Modules," Proceedings of the International Symposium on Microelectronics, 1993, pp. 483-488.
11. J.P. Cazenave, "High-Density Interconnections with Thick-Film MCMs," Solid State Technology, May 1994.
12. S.A. Gallo, J.D. Smith, T.R. Suess, B.E. Taylor, and C.B. Wang, "Advanced Thick-Film Materials for Flat-Panel Displays, Proceedings of the 11th European Microelectronics Conference, Venice, Italy, May 1997, pp. 229-236.
13. DuPont, "Green Tape™ Material System, Design and Layout Guideline," January 8, 1998.