A new low loss lead free LTCC system for wireless and RF applications

Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging

Volumn 1998-April, Issue , 1998, Pages 196-199

  Donahue, P C ^a   Taylor, B E ^a   Amey, D I ^a   Draudt, R R ^a   Smith, M A ^a   Horowitz, S J ^a   Larry, J R ^a  

^a DUPONT COMPANY   (United States)

Author keywords

ceramic; Green TapeTM; Low loss; LTCC

Indexed keywords

ALUMINA; ALUMINUM OXIDE; CERAMIC MATERIALS; MICROELECTRONICS; MICROPROCESSOR CHIPS; MICROWAVE RESONATORS; TEMPERATURE;

BASED ON ALUMINA; CERAMIC; GREEN TAPETM; HIGH FREQUENCY CIRCUITS; LOW-LOSS; LOW-TEMPERATURE CO-FIRED CERAMICS; LTCC; RF APPLICATIONS;

MULTICHIP MODULES;

EID: 9644285395     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICMCM.1998.670779     Document Type: Conference Paper

References (6)

1. D.I. Amey and S.J. Horowitz "Microwave Material Characterization" Proceedings of the International Symposium on Microelectronics (ISHM), pp 494-499, 1996
2. W.D. Kingery, H.K. Bowen and D.R. Uhlmann, "Introduction to Ceramics", second edition. 1976. John Wiley & sons, p.943.
3. J.H. Alexander , S. K. Muralidhar, G.J. Roberts and T.J. Vlach. "A Low Temperature Cofiring Tape System Based on a Crystallizing Glass" ISHM Proceedings, p 414. 1991.
4. Rich and K. Sparks, " Microwave Dielectric Constant of a Low Temperature Cofired Ceramic", Proceedings of the 41 st Electronic Components and Technology Conference, pp20-25, 1991
5. J. Gipprich, K. Leahey, A. Martin, E S. Vasudevan and A. Shaikh,' Microwave Characterization of Low Temperature Cofired Tape" Advancing Microelectronics ppl6-24, November/December, 1995.
6. P.C. Donohue. D.I. Amey, M.A. Saltzberg and S.S. Gallo. "New Low Insertion Loss Green Tape" System for High Frequency applications" the Ceramic Society of Japan Proceedings. p 66, 1994