Ceramic technology for integrated packaging for wireless

IEEE Radio Frequency Integrated Circuits Symposium, RFIC, Digest of Technical Papers

Volumn , Issue , 1999, Pages 63-66

  Amey, Dan ^a   Barnwell, Peter ^a   Brown, Ray ^a   Gaughan, Frank ^a   Horowitz, Sam ^a   London, Andy ^a   Novak, Rodd ^a   Slutz, Don ^a   Wilcox, Dave ^a  

^a DUPONT COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC TECHNOLOGY; INTEGRATED PACKAGING;

BANDWIDTH; CERAMIC MATERIALS; INTEGRATED CIRCUIT MANUFACTURE; NETWORK COMPONENTS; PERSONAL COMMUNICATION SYSTEMS; PRINTED CIRCUIT BOARDS; WIRELESS TELECOMMUNICATION SYSTEMS;

ELECTRONICS PACKAGING;

EID: 0032641340     PISSN: 10972633     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)