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Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 40, Issue 4 A, 2001, Pages 2408-2412

Thermal stability enhancement of Cu interconnects by employing a self-aligned MgO layer obtained from a Cu(Mg) alloy film

(9) Lee, W a Cho, H b Cho, B b Yang, H J b Kim, J b Reucroft, P J c Lee, C d Lee, E e Lee, J a

a Sejong University (South Korea)

b Kookmin University (South Korea)

c UNIVERSITY OF KENTUCKY (United States)

d Inha University (South Korea)

e Chosun University (South Korea)

Author keywords

Cu(Mg) alloy film; Diffusion barrier; Interconnect; Metallization; Thermal stability

Indexed keywords

ANNEALING; COPPER; INTERDIFFUSION (SOLIDS); MAGNETRON SPUTTERING; METALLIZING; MULTILAYERS; PASSIVATION; THERMODYNAMIC STABILITY; VACUUM APPLICATIONS; X RAY DIFFRACTION;

COPPER INTERCONNECTS;

MAGNESIA;

EID: 0035302007 PISSN: 00214922 EISSN: None Source Type: Journal
DOI: 10.1143/jjap.40.2408 Document Type: Article

Times cited : (9)

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