Surface electromigration of sputtered copper patterned using ion milling or chemical mechanical polishing

Journal of Materials Science: Materials in Electronics

Volumn 12, Issue 4-6, 2001, Pages 307-312

  Toh, B H W ^a   McCusker, N D ^a   McNeill, D W ^a   Gamble, H S ^a   Len, V ^a  

^a QUEEN'S UNIVERSITY BELFAST   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; DIFFUSION IN SOLIDS; ELECTRON TRANSPORT PROPERTIES; GRAIN SIZE AND SHAPE; MILLING (MACHINING); ORGANIC COMPOUNDS; PASSIVATION; SPUTTERING; SURFACE TREATMENT;

BENZOTRIAZOLE; ION MILLING; MEAN TIME TO FAILURE; PASSIVATING AGENT; SPIN ON GLASS; SURFACE DIFFUSION; SURFACE ELECTROMIGRATION;

COPPER;

EID: 0035299493     PISSN: 09574522     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1011288110082     Document Type: Article

References (9)