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Volumn 24, Issue 1, 2001, Pages 92-98

Bonding stress and reliability of high power GaAs-based lasers

Author keywords

Bonding stress; Conductive epoxies; Eutectic lead tin solder; Gallium arsenide; Laser reliability; Photoluminescence; Semiconductor stress

Indexed keywords

ADHESIVES; BONDING; COPPER; HEAT SINKS; HIGH POWER LASERS; LIGHT POLARIZATION; PHOTOLUMINESCENCE; SEMICONDUCTING GALLIUM ARSENIDE; STRESS ANALYSIS; THERMAL CONDUCTIVITY; THERMAL EXPANSION;

EID: 0035278838     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.910807     Document Type: Article
Times cited : (32)

References (24)
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  • 5
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    • Material and fabrication-related limitations to high-power operation of GaAs/AlGaAs and InGaAs/AlGaAs laser diodes
    • (1997) Mater. Sci. Eng. B , vol.44 , pp. 359-363
    • Jakubowicz, A.1
  • 13
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    • Strain-enhanced luminescence degradation in GaAs/GaAlAs double-heterostructure lasers revealed by photoluminescence
    • (1979) J. Appl. Phys. , vol.50 , pp. 7914-7916
    • Wakefield, B.1
  • 15
    • 0029292686 scopus 로고
    • Strain measurement and estimation of photoelastic effects and strain-induced optical gain change in ridge wave-guide lasers
    • (1995) J. Appl. Phys. , vol.77 , pp. 3382-3387
    • Yang, J.1    Cassidy, D.T.2
  • 24
    • 0032652837 scopus 로고    scopus 로고
    • A Comparative study of silver-epoxy and tin-lead solder in their joints with copper, through mechanical and electrical measurements during debonding
    • (1999) J. Mater. Sci. , vol.34 , pp. 273-281
    • Luo, X.1    Chung, D.D.L.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.