SCOPUS 정보 검색 플랫폼

Volumn 16, Issue 2, 2001, Pages 385-393

Evaluation of the modified edge lift-off test for adhesion characterization in microelectronic multifilm applications

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; BENDING (DEFORMATION); CRACKS; ELASTIC MODULI; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); MICROELECTRONICS; SUBSTRATES;

MICROELECTRONIC MULTIFILMS;

SEMICONDUCTING FILMS;

EID: 0035262063 PISSN: 08842914 EISSN: None Source Type: Journal
DOI: 10.1557/JMR.2001.0058 Document Type: Article

Times cited : (21)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.