Novel approach to sputtered tantalum film resistors with controlled pre-defined resistance

Microelectronics Journal

Volumn 32, Issue 1, 2001, Pages 61-67

  Golan, G ^a   Axelevitch, A ^a   Margolin, R ^a   Rabinovitch, E ^a  

^a HOLON INSTITUTE OF TECHNOLOGY   (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC RESISTANCE; MATHEMATICAL MODELS; SPUTTER DEPOSITION; TANTALUM; THIN FILM DEVICES; VACUUM TECHNOLOGY;

CONTROLLED PRE-DEFINED RESISTANCE; SPUTTERED TANTALUM FILM RESISTORS; VACUUM PHOTOTHERMAL PROCESSING (VPP);

RESISTORS;

EID: 0035200594     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2692(00)00101-4     Document Type: Article

References (20)

1. Westwood W.D., Waterhouse N., Wilcox P.S. Tantalum Thin Films. 1975;Academic Press, New York.
2. K. Chen, M. Nielsen, S. Soss, E.J. Rymaszewski, T.-M. Lu, C.T. Wan, Study of Tantalum Oxide Thin Film Capacitors on Metallized Polymer Sheets for Advanced Packaging Applications, IEEE Transactions on Components, Packaging, and Manufacturing Technology Part B: Advanced Packaging, May 1997, 20, 02, p. 117.
3. Tantalum Ethoxide and Niobium Ethoxide, http://www.cerac.com/proddata/ethoxds.htm.
4. Process of Fabrication Dynamic Random Access Memory Device United States Patent 5,726,083, Takaishi, March 10, 1998.
5. Characterisation of Defect States in Tantalum Pentoxide Films for Very High Density DRAM Applications. http//www.eng.nus.sg/Eresnews/May95/wslau.html.
6. 5 for Optical Coating, http//www.cerac.com/proddata/ta2o5.htm.
7. A.S. Poghossian, The mechanism of blood-compatibility of some materials used in biomedical sensors. Proceedings of the East Asia Conference on Chemical Sensors, October 12-13, Supplement B, 1993.
8. 5 thin films by magnetron reactive sputtering. J. Electron. Mater. 26:1997;4.
9. Mukaida M., Imai Y., Watanabe A., Osato K., Kameyama T., Fukuda K. Electrical property of tantalum oxide films prepared by KrF excimer laser chemical vapor deposition. Trans. Mater. Res. Jpn. 14A:1994;767-770.
10. Gerstenberg D., Calbick C.J. J. Appl. Phys. 35:1964;402.
11. Hennings K.E., Strahle U.D. Schweigz. Archiv Fer Angewandte Wissensch. Tech. (Switzerland). 35:1969;365.
12. Livermore F.C., Wilcox P.S., Westwood W.D. J. Vac. Sci. Technol. 8:1971;155.
13. Resistor technology assessed at microwave frequencies, http://www.kditriangle.com/pdfiles/APPNOTE5.pdf.
14. 5 for optical coating, http://www.cerac.com/pubs/proddata/ta205.htm.
15. Golan G., Axelevitch A. Ring etching zones on magnetron sputtering targets. Thin Solid Films. 300:1997;72-77.
16. Golan G., Axelevitch A., Rabinovitch E., Margolin R. Vacuum photothermal processing (VPP) for complex thin film systems curing. J. Optoelectron. Adv. Mater. 1:(4):1999;69-80.
17. 3 for UV vidicon applications. Thin Solid Films. 283:1996;235-238.
18. 3 electrodes. J. Vac. Sci. Technol. A. 16:(4):1998;2614-2618.
19. Cernahan B., Luther H.A., Wilkes J.O. Applied Numerical Methods. 1969;Wiley, New York.
20. B.P. Demidovich, I.A. Maron, Calculus Mathematics Fundamentals (in Russian), Science, Moscow, 1970.