A novel compact ECD tool for ULSI Cu metallization

IEEE International Symposium on Semiconductor Manufacturing Conference, Proceedings

Volumn , Issue 1, 2000, Pages 106-109

  Tsujimura, Manabu ^a   Mishima, Koji ^a   Kunisawa, Junji ^a   Makino, Natsuki ^a   Matsuda, Tetsuo ^a   Kaneko, Hisashi ^a   Okumura, Katsuya ^a  

^a EBARA CORPORATION   (Japan)

Author keywords

Cu metallization; ECD; Porous ceramic

Indexed keywords

ANODES; CERAMIC MATERIALS; COPPER; DOPING (ADDITIVES); ELECTRIC CURRENTS; ELECTROCHEMISTRY; FINITE ELEMENT METHOD; METALLIZING; POROUS MATERIALS;

ELECTROCHEMICAL DEPOSITION;

ULSI CIRCUITS;

EID: 0034583842     PISSN: 1523553X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)

1. Technical symposium