Simulation of microstructural evolution induced by scanned laser annealing of metallic interconnects

Journal of Electronic Materials

Volumn 30, Issue 1, 2001, Pages 11-16

  Hau Riege, C S ^a   Hau Riege, S P ^a   Thompson, C V ^a  

^a USA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; COMPUTER SIMULATION; GRAIN GROWTH; GRAIN SIZE AND SHAPE; LASER APPLICATIONS; SINGLE CRYSTALS; THERMAL EFFECTS;

METALLIC INTERCONNECTS; SCANNED LASER ANNEALING (SLA);

METALLOGRAPHIC MICROSTRUCTURE;

EID: 0035148672     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-001-0208-7     Document Type: Article

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