Laser micromachining and nickel-plating of high aspect ratio structures in polymer molds

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4236, Issue , 2001, Pages 222-229

  Jin, H ^a   Ghantasala, M K ^a   Hayes, J P ^a   Jolic, K ^a   Harvey, E C ^a  

^a SWINBURNE UNIVERSITY OF TECHNOLOGY   (Australia)

Author keywords

Dry film photoresists and profilometry; Electroplating; High aspect ratio structures (HARS); Laser micromachining

Indexed keywords

ASPECT RATIO; ELECTROPLATING; FILM GROWTH; LASER APPLICATIONS; MICROMACHINING; NICKEL PLATING; PHOTORESISTORS; PRINTED CIRCUIT BOARDS; PROFILOMETRY; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; SUBSTRATES; SURFACE ROUGHNESS; X RAY PHOTOELECTRON SPECTROSCOPY;

DRY FILM PHOTORESISTS; LASER MICROMACHINING; POLYMER MOLDS;

PLASTIC MOLDS;

EID: 0035015989     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.418760     Document Type: Conference Paper

References (12)

1. A laser-ablation and lift-off technique for fabricating simple microfluidic devices
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5. Development of biofactory-on-a-chip technology using excimer laser micromachining
6. Laser microprojection for micromechanical device fabrication
7. Microstructuring by excimer laser
8. Multishot ablation of polymer and metal films at 248 nm
9. Excimer laser patterning of thick and thin films for high density packaging
10. Excimer laser etching and patterning of metals