A Monte Carlo percolative approach to reliability analysis of semiconductor structures

Mathematics and Computers in Simulation

Volumn 55, Issue 1-3, 2001, Pages 231-238

  Pennetta, C ^a,b   Reggiani, L ^a,b   Trefan Gy ^a  

^a INFN SEZIONE DI LECCE   (Italy)

^b UNIVERSITY OF SALENTO   (Italy)

Author keywords

Integrated circuits; Joule heating; Monte Carlo percolative approach

Indexed keywords

MONTE CARLO METHODS; PROBABILITY DISTRIBUTIONS; RELIABILITY; RESISTORS; SEMICONDUCTOR DEVICE MODELS; SUBSTRATES; THIN FILMS;

JOULE HEATING; MONTE CARLO PERCOLATIVE METHOD;

SEMICONDUCTING FILMS;

EID: 0034921972     PISSN: 03784754     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0378-4754(00)00266-4     Document Type: Article

References (11)

1. Electromigration: A review
2. Electromigration in thin-film interconnection lines: Models, methods and results
3. Electrical noise and VLSI interconnect reliability
4. Measurement of the electrical properties of electromigration specimens
5. 1/f noise in random resistor networks: Fractals and percolating systems
6. The role of microgeometry in the electrical breakdown of metal-insulator mixtures
7. Biased percolation and abrupt failure of electronic devices
8. Biased percolation and electrical breakdown
9. Thermal effects on the electrical degradation of thin film resistors
10. Time-dependent damage evolution and failure in materials