Creep-fatigue life evaluation of solder based on creep characteristics

Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A

Volumn 64, Issue 617, 1998, Pages 50-57

  Taneda, Motoharu ^a   Kaminishi, Ken ^a   Motohiro, Seiji ^a  

^a NONE

Author keywords

Creep; Fatigue life evaluation; Finite element method; High temperature; Joint of through hole type; Low cycling frequency; Reduced creep rate; Solder

Indexed keywords

EID: 0003733573     PISSN: 03875008     EISSN: None     Source Type: Journal    
DOI: 10.1299/kikaia.64.50     Document Type: Article

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