Analytical and experimental hybrid study on thermal fatigue strength of electronic solder joints: (1st report, rationalization of accelerated thermal cyclic test and evaluation of thermal fatigue)

Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A

Volumn 64, Issue 619, 1998, Pages 550-557

  Yu, Qiang ^a   Shiratori, Masaki ^a   Wang, Shubo ^a   Kaneko, Seiji ^a   Ishihara, Tatsuya ^a  

^a NONE

Author keywords

Accelerated test; Finite element method; Microelectronic solder joint; Plastic and creep analyses; Thermal fatigue strength

Indexed keywords

EID: 0003733575     PISSN: 03875008     EISSN: None     Source Type: Journal    
DOI: 10.1299/kikaia.64.550     Document Type: Article

References (12)

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2. Solomon, H. D., IEEE Trans. CHMT. 9-4, (1996), 423-432.
3. Engelmaier, W., IEEE Trans. CHMT, 6-3, (1993), 232-237.
4. Dasgupta, A., Oyan, C., Baker, D. and Pecht, M., Trans. ASME, 114 (1992), 152-160.
5. Shiratori, M., Yu, Q. and Wang, S. B., Advances in Electronic Packaging, ASME. EEP-10-1 (1995), 451-457.
6. Pan, T-Y., Thermal Cycling Induced Plastic Deformation in Solder Joints - part 1: Accumulated Deformation in Surface Mount Joints, ASME, J. Electronic Packaging, 113 (1991), 8-15.