Lead-free solders: Technology

SMT Surface Mount Technology Magazine

Volumn 13, Issue 8, 1999, Pages 16-18

  Hwang, Jennie S ^a  

^a H Technologies Group Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0003536335     PISSN: 15298930     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (7)

1. Jennie S. Hwang, George Lucey, Roger B. Clough and James Marshall, "Futuristic Solders -Utopia or Ultimate Performance?" Surface Mount Technology, September 1991, p. 40.
2. Jennie S. Hwang, Modern Solder Technology for Competitive Electronics Manufacturing, McGraw Hill, N.Y., 1996, Chapter 15.
3. Jennie S. Hwang and Z. Guo, "Lead-free Solders for Electronic Packaging and Assembly," Proceedings, SMI Conference, 1993, p. 732.
4. Jennie S. Hwang, "Overview of Lead-free Solders for Electronic Microelectronics," Proceedings, Surface Mount International, 1994, p. 405.
5. Jennie S. Hwang and Holger Koenigsmann, "New Developments of Lead-free Solders," Proceedings, Surface Mount International, 1997.
6. H-Technologies Group -Internal Reports, 1996, 1997, 1998.
7. The list of 54 references, Modem Solder Technology for Competitive Electronics Manufacturing, McGraw Hill, N.Y., 1996, Chapter 15.