SCOPUS 정보 검색 플랫폼

Soldering and Surface Mount Technology

Volumn 13, Issue 3, 2001, Pages 12-15

The effect of PECVD SiNx moisture barrier layers on the degradation of a flip chip underfill material

(4) Kaltenpoth, G a Siebert, W a Xie, X M b Stubhan, F b

a UNIVERSITY OF HEIDELBERG (Germany)

b DaimlerChrysler SIM Technology Co Ltd (China)

Author keywords

Barriers; Delamination; Flip chip; Reliability

Indexed keywords

DEGRADATION; DELAMINATION; FAILURE (MECHANICAL); INTEGRATED CIRCUITS; MICROSCOPIC EXAMINATION; MOISTURE; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PRINTED CIRCUIT BOARDS; SEMICONDUCTING FILMS; SILICON NITRIDE; THERMAL CYCLING; THERMAL EXPANSION;

C-MODE SCANNING ACOUSTIC MICROSCOPY; MOISTURE BARRIER LAYER; SILICON NITRIDE FILM; UNDERFILL MATERIAL;

FLIP CHIP DEVICES;

EID: 0034765160 PISSN: 09540911 EISSN: None Source Type: Journal
DOI: 10.1108/EUM0000000006024 Document Type: Article

Times cited : (3)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.