Thermomechanical modeling of the EUV reticle during exposure

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4343, Issue , 2001, Pages 515-523

  Martin, C J ^a   Engelstad, R L ^a   Lovell, E G ^a  

^a University of Wisconsin Madison   (United States)

Author keywords

EUV lithography; EUV reticles; Exposure; Finite elements; Thermomechanical response

Indexed keywords

BOUNDARY CONDITIONS; DEFORMATION; FINITE ELEMENT METHOD; THERMAL EXPANSION; THERMOMECHANICAL TREATMENT; ULTRAVIOLET RADIATION;

EXTREME ULTRAVIOLET LITHOGRAPHY (EUVL); THERMOMECHANICAL MODELING;

PHOTOLITHOGRAPHY;

EID: 0034763270     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.436683     Document Type: Conference Paper

References (6)

1. Thermal management of EUV lithography masks using low expansion glass substrates
2. Thermal-mechanical performance of extreme ultraviolet lithographic reticles
3. EUCLIDES: First phase completed!
4. New contact and gap correlations for conforming rough surfaces