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Volumn 605, Issue , 2000, Pages 287-292

Study of PZT film stress in multilayer structures for MEMS devices

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC FILMS; MECHANICAL VARIABLES MEASUREMENT; MICROELECTROMECHANICAL DEVICES; MULTILAYERS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; RAPID THERMAL ANNEALING; RESIDUAL STRESSES; SILICA; SILICON NITRIDE; TENSILE STRESS; THICKNESS MEASUREMENT;

EID: 0034510814     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (9)

References (8)
  • 7
    • 0002429638 scopus 로고
    • Principles and Applications of Wafer Curvature Techniques for Stress Measurements in Thin Films
    • P.A. Flinn, "Principles and Applications of Wafer Curvature Techniques for Stress Measurements in Thin Films," Mat. Res. Soc. Symp. Proc. 130, 41 (1989).
    • (1989) Mat. Res. Soc. Symp. Proc. , vol.130 , pp. 41
    • Flinn, P.A.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.