Analysis of the stress and interfacial reactions in Pt/Ti/SiO2/Si for use with ferroelectric thin films

Journal of Electronic Materials

Volumn 27, Issue 5, 1998, Pages 418-426

  Madsen, Lynnette D ^a,b   Weaver, Louise ^c   Ljungcrantz, Henrik ^a,d   Clark, Alison J ^e,f  

^a LINKÖPING UNIVERSITY   (Sweden)

^b MCMASTER UNIVERSITY   (Canada)

^c Mat and Metallurgical Engineering   (Canada)

^d Tixon AB   (Sweden)

^e NORTEL NETWORKS   (Canada)

^f UNIVERSITY OF BRITISH COLUMBIA   (Canada)

Author keywords

Barrier; Electrode; PZT; Scanning electron microscopy (SEM); Stress; XRD

Indexed keywords

EID: 0042466365     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-998-0171-7     Document Type: Article

References (47)

1. C.A. Paz de Araujo, L.D. McMillan, B.M. Melnick, J.D. Cuchiaro and J.F. Scott, Ferroelectrics 104, 241 (1990).
2. R.N. Castellano, J. Vac. Sci. Technol. 17 (2), 629 (1980).
3. M. Oikawa and K. Toda, Appl. Phys. Lett. 29 (8), 491 (1976).
4. A. Croteau, S. Matsubara, Y. Miyasaka and N. Shohata, Proc. 6th Mtg. Ferroelec. Mater. & Appl., Kyoto and Jpn. J. Appl. Phys. 26 18 (1987).
5. A. Croteau, S. Matsubara, Y. Miyasaka and N. Shohata, Proc. 6th Mtg. Ferroelec. Mater. & Appl., Kyoto and Jpn. J. Appl. Phys. 26 18 (1987).
6. A. Croteau and M. Sayer, Proc. 6th IEEE Integr. Symp. on Applic. of Ferroelec. (New York: IEEE, 1986), p. 606.
7. E.V. Sviridov, V.M. Mukhortov, V.P. Dudkevich and E.G. Fesenko, Sov. Phys. Tech. Phys. 30 (5), 576 (1985).
8. Y. Shintani, K. Sato, M. Sakamoto, H. Fukuda and O. Tada, Jpn. J. Appl. Phys. 17 (3), 573 (1978).
9. D.A. Payne, K.D. Budd, R.W. Swartz and S. Dey, Sol-Gel Processing of Thin-Layer Ferroelectrics, Symp. on Integr. Ferroelec. Colorado Springs, (1989).
10. G. Yi, Z. Wu and M. Sayer, J. Appl. Phys. 64 (5), 2717 (1988).
11. K.L. Saenger, R.A. Roy, K.F. Etzold and J.J. Cuomo, Mater. Res. Soc. Symp. Proc. 200 (Pittsburgh, PA: Mater. Res. Soc., 1990), p. 115.
12. K. Ramakumar, J. Lee, A. Safari and S.C. Danforth, Mater. Res. Soc. Symp. Proc. 200 (Pittsburgh, PA: Mater. Res. Soc., 1990), p. 121.
13. C.K. Chiang, L.P. Cook, P.K. Schenek, P.S. Brody and J.M. Benedetto, Mater. Res. Soc. Symp. Proc. 200 (Pittsburgh, PA: Mater. Res. Soc., 1990), p. 133.
14. F.W. Ainger, C.J. Brierley, M.D. Hudson, C. Trundle and R.W. Whatmore, Mater. Res. Soc. Symp. Proc. 200 (Pittsburgh, PA: Mater. Res. Soc., 1990), p. 37.
15. M. Okada, K. Tominaga, T. Araki, S. Katayama and Y. Sakashita, Jpn. J. Appl. Phys. 29, 718 (1990).
16. A. Kavanaugh and J.O. Williams, Brit. Ceram. Proc. (41), 59 (1989).
17. D.B. Bondurant, Ferroelec. 112 (B), 273 (1990).
18. A standard semiconductor cleaning procedure.
19. L.D. Madsen, Ph.D. thesis, McMaster University, Hamilton, Ont., Canada (1994); L.D. Madsen, L. Weaver and A.J. Clark, Can. J. Phys. 74, 580 (1996).
20. L.D. Madsen, Ph.D. thesis, McMaster University, Hamilton, Ont., Canada (1994); L.D. Madsen, L. Weaver and A.J. Clark, Can. J. Phys. 74, 580 (1996).
21. P.-H. Chang, M.D. Coviello and A.F. Scott, Mater. Res. Soc. Symp. Proc. 115 (Pittsburgh, PA: Mater. Res. Soc., 1988), p. 93.
22. L. Weaver, Microsc. Res. and Techn. 36 (5), 378 (1997).
23. Joint Committee on Powder Diffraction Standards International Centre for Diffraction Data- JCPDS, (1992).
24. I.C. Noyan and J.B. Cohen, Residual Stress Measurement by Diffraction and Interpretation, (New York: Springer, 1987).
25. W. Koster and J. Scherb, Zietschrift für Metallkunde 49, 501 (1958).
26. Metals Handbook, 9th Ed., (Metals Park, OH: ASM Intl., 1994), vol. 2.
27. H.N. Al-Shareef, K.D. Gifford, S.H. Rou, P.D. Hren, O. Auciello and A.I. Kingon, Integr. Ferroelec. 3, 321 (1993).
28. P.D. Hren, H. Al-Shareef, S.H. Rou, A.I. Kingon, P. Buaud and E.A. Irene, Mater. Res. Soc. Symp. Proc. 260 (Pittsburgh PA: Mater. Res. Soc., 1992), p. 575.
29. D.J. Eichorst, T.N. Blanton, C.L. Barnes and L.A. Bosworth, Integr. Ferroelec. 4, 239 (1994).
30. G.R. Fox, S. Trolier-McKinstry, S. B. Krupanidhi and L.M. Casas, J. Mater. Res. 10 (6), 1508 (1995).
31. D.W. Hoffman and J.A. Thorton, Thin Solid Films 45, 387 (1977).
32. H. Ljungcrantz, L. Hultman, J.-E. Sundgren, S. Joahnsson, N. Kristensen, J.-A. Schweitz and C.J. Shute, J. Vac. Sci. Technol. A 11 (3), 543 (1993).
33. K.-H. Müller, J. Appl. Phys. 58, 2578 (1985).
34. M. Itoh, M. Hori and S. Nadahara, J. Vac. Sci. and Technol. B 9, 149 (1991).
35. G.A.C.M. Spierings, J.B.A. van Zon and P.K. Larsen, Integr. Ferroelec. 3, 283 (1993).
36. H. Ljungcrantz, Ph.D. thesis, Linköping University Linköping, Sweden (1995).
37. T.C. Tisone and J. Drobeck, J. Vac. Sci. & Technol. 9 (1), 271 (1971).
38. J.O. Olowolafe, R.E. Jones, A.C. Campbell, P.D. Maniar, R.I. Hegde and C.J. Mogab, Mater. Res. Soc. Symp. Proc. 243 (Pittsburgh, PA: Mater. Res. Soc., 1992), p. 355.
39. A.C. Greenwald, J.T. Daly and N.M. Kalkhoran, Mater. Res. Soc. Symp. Proc. 243 (Pittsburgh, PA: Mater. Res. Soc., 1992), p. 229.
40. A. Katz and W.C. Dautremont-Smith, J. Appl. Phys. 67 (10), 6237 (1990).
41. K. Sreenivas, I. Reaney, T. Maeder, N. Setter, C. Jagadish and R.G. Elliman, J. Appl. Phys. 75 (1), 232 (1994).
42. A. I. Kingon, presented at Intl. Symp. on Integr. Ferroelectrics CA (1992).
43. S. Merklein, D. Sporn and A. Schöunecker, Mater. Res. Soc. Symp. Proc. 310 (Pittsburgh, PA: Mater. Res. Soc., 1993), p. 263.
44. A. Grill, D. Beach, C. Smart and W. Kane, Mater. Res. Soc. Symp. Proc. 310 (Pittsburgh, PA: Mater. Res. Soc., 1993), p. 189.
45. R.W. Schwartz, D. Dimos, S.J. Lockwood and V.M. Torres, Mater. Res. Soc. Symp. Proc. 310 (Pittsburgh, PA: Mater. Res. Soc., 1993), p. 59.
46. S.J. Lockwood, R.W. Schwartz, B.A. Tuttle and E.V. Thomas, Mater. Res. Soc. Symp. Proc. 310 (Pittsburgh, PA: Mater. Res. Soc., 1993), p. 275.
47. H. Al-Shareef, K.D. Gifford, P.D. Hren, S.H. Rou, O. Auciello and A.I. Kingon, Intl. Symp. on Integr. Ferroelec. (1992), p. 181.