On the superiority of DO-RE-ME/MPG-D over stuck-at-based defective part level prediction

Proceedings of the Asian Test Symposium

Volumn , Issue , 2000, Pages 151-157

  Dworak, Jennifer ^a   Grimaila, Michael R ^a   Cobb, Brad ^a   Wang, T C ^a   Wang, L C ^a   Mercer, M Ray ^a  

^a Texas A and M University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

STUCK-AT FAULTS DEFECTIVE PART LEVEL PREDICTIONS;

CORRELATION METHODS; ELECTRIC NETWORK ANALYSIS; ELECTRIC NETWORK SYNTHESIS; FAULT TOLERANT COMPUTER SYSTEMS; INTEGRATED CIRCUIT LAYOUT; SEMICONDUCTOR DEVICE MODELS;

LOGIC CIRCUITS;

EID: 0034505816     PISSN: 10817735     EISSN: None     Source Type: Journal    
DOI: 10.1109/ATS.2000.893618     Document Type: Article

References (19)

1. Agrawal, V.D. and Agrawal, P., "An Automatic Test Generation System for Illiac IV Logic Boards," IEEE Trans, on Computers, Vol. C-21, no. 9, 1972, pp. 1015-1017.
2. Agrawal, V.D., Seth, S.C., and Agrawal P., "Fault coverage requirement i production testing of LSI circuits," IEEE Journal of Solid State Circuits, Vol. SC-17, no. 1, February 1982, pp. 57-61.
3. Brglez, F. and Fujiwara, "A Neutral Netlist of 10 Combination Benchmark Circuits and a Target Translator in FORTRAN," Proc. Int. Symp. Circuits Syst., 1985.
4. Dworak, J., Grimaila, M.R., Lee, S., Wang, L.C., and Mercer, M.R., "Modeling the probability of defect excitation for a commercial IC with implications for stuck-at fault-based ATPG strategies," Proc. International Test Conference 1999, pp. 1031-1037.
5. Dworak, J., Grimaila, M.R., Lee, S., Wang, L.C., and Mercer, M.R., "Enhanced DO-RE-ME Based Defect Level Prediction Using Defect Site Aggregation - MPG-D," Proc. International Test Conference 2000.
6. Eldred, R.D., "Test routines based upon symbolic logic statements," J. Assoc. Comput. Mach., vol. 6, 1959, pp. 33-36.
7. Ferguson, F.J., and Larrabee, T., "Test pattern generation for realistic bridge faults in CMOS ICs," Proc. Int. Test Conf, 1991, pp. 492-499.
8. Grimaila, M.R., Lee, S., Dworak, J., Butler, K.M., Stewart, B., Balachandran, H., Houchins, B., Mathur, V., Park, J., Wang, L.C., Mercer, M.R., "REDO - Random Excitation and Deterministic Observation - First Commercial Experiment," Proc. VLSI Test Symposium 1999, pp. 268-274.
9. Kapur, R., Park, J., and Mercer, M.R., "All tests for a fault are not equally valuable for defect detection," Proc. International Test Conference 1992, pp. 762-769.
10. Lee, H.K. and Ha, D.S., "On the generation of test patterns for combinational circuits," Technical Report No. 12, Department of Electrical Engineering, Virginia Polytechnic Institute and State University, 1993.
11. Losq, J., "Referenceless Random Testing," Proc. Int. Symp. on Fault-Tolerant Computing, 1976, pp. 108-113.
12. Maxwell, P.C. and Aitken, R.C, "IDDQ Testing as a Component of a Test Suite: The Need for Several Fault Coverage Metrics," J. of Electronic Testing (JETTA), vol. 3, 1992, pp. 305-316.
13. Maxwell, P.C., Aitken, R.C., Johansen, V., and Chiang, I., "The Effectiveness of IDDQ, Functional, and Scan Tests: How Many Fault Coverages Do We Need?," Proc. Int. Test Conf, 1992, pp. 168177.
14. Mei, K.C., "Bridging and stuck-at faults," IEEE Trans, on Computers, vol. C-23, no. 7, 1974, pp. 8794.
15. Millman, S.D. and McCluskey, E.J., "Detecting bridging faults with stuck-at test sets," Proc. Int. Test Conf, 1988, pp. 773-783.
16. Park, J., Naivar, M., Kapur, R., Mercer, M.R., and Williams, T.W., "Limitations in predicting defect level based on stuck-at fault coverage," Proc. VLSI Test Symposium 1994, PP- 186-191.
17. Schnurmann, H.D., Lindbloom, E., Carpenter, R.G., "The Weighted Random Test Pattern Generator," IEEE Trans, on Computers, Vol. C-24, no. 7, 1975, pp. 695-700.
18. Wang, L-C., Mercer, M.R., Williams, T.W., and Kao, S.W., "On the Decline of Tesing Efficiency as Fault Coverage Approaches 100%," Proc. VLSI Test Symposium 1995, pp. 74-83.
19. Williams, T.W. and Brown, N.C. "Defect level as a function of fault coverage," IEEE Trans, on Computers, Vol. C-30, no. 12, 1981, pp. 987-988.