Three-dimensional microfabrication for a multi-degree-of-freedom capacitive force sensor using fibre-chip coupling

Journal of Micromechanics and Microengineering

Volumn 10, Issue 4, 2000, Pages 492-497

  Enikov, E T ^a   Nelson, B J ^b  

^a University of Arizona   (United States)

^b University of Minnesota   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CAPACITANCE MEASUREMENT; CHEMICAL POLISHING; MICROMACHINING; OPTICAL FIBER COUPLING; REACTIVE ION ETCHING; SILICON WAFERS; THIN FILMS;

CAPACITIVE FORCE SENSORS; FUSION BONDING; MICRO-TWEEZERS; MICROFABRICATION;

MICROSENSORS;

EID: 0034499618     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/10/4/302     Document Type: Article

References (19)

1. Strandman C, Rosengren L, Elderstig H and Backlund Y 1995 Fabrication of 45 ° mirrors together with well-defined v-grooves using wet anisotropic etching of silicon J. Microelectromech. Syst. 4 213-9
2. Offereins H L, Kühl K and Sandmaier H 1991 Methods for the fabrication of convex corners in anisotropic etching of (100) silicon in aqueous KOH Sensors Actuators A 25-27 9-13
3. Wensink H, de Boer M, Wiegerink R, Zwijze A and Elwenspoek M 1997 First micromachined silicon load cell for loads up to 1000 kg Proc. SPIE 3514 424-30
4. Dickensheets D L and Kino G S 1998 Silicon-micromachined scanning confocal optical microscope J. Microelectromech. Syst. 7 38-47
5. Kamura Y and Yanagimachi R 1995 Intracytoplasmic sperm injection in the mouse Biol. Reprod. 52 709-20
6. Needham D and Nunn R S 1990 Elastic deformation and failure of lipid bilayer membranes containing cholesterol Biophys. J. 58 997-1009
7. Enikov E T and Nelson B J 1999 MEMS based single cell penetration force sensor Microrobotics and Microassembly - Proc. SPIE (Boston, MA, USA, September 1999) ed B Nelson and J Breguet, vol 3834
8. Wiegerink R, Zwijze R, Krijnen G, Lammerink T and Elwenspoek M 2000 Quasi-monolithic silicon load cell for loads up to 1000 kg with insensitivity to non-homogeneous load distributions Sensors Actuators A 80 189-96
9. Chui B, Kenny T, Mamin H, Terris B and Ruger D 1998 Independent detection of vertical and lateral forces with a sidewall implanted dual-axis piezoresistive cantilever Appl. Phys. Lett. 72 1388-90
10. Park K-Y, Lee C-W, Oh Y-S and Cho Y-H 1998 Laterally oscilated and force-balanced micro vibratory rate gyroscope supported by fish-hook shaped springs Sensors Actuators A 64 69-76
11. Li X, DeJong G, Meijer G, Toth F and Van-Der-Goes F 1997 Low-cost cmos interface for capacitive sensors and its application in a capacitive angular encoder Analog Integr. Circuits Signal Process. 14 223-33
12. Stoer J and Bulirsch R 1992 Texts in Applied Mathematics: Introduction to Numerical Analysis vol 12 (New York: Springer)
13. Ruska W S 1981 Microelectronic Processing (New York: McGraw-Hill)
14. Mitani K and Gösele U 1992 Wafer boding technology for silicon-on-insulator applications: a review J. Electron. Mater. 21 669-76
15. Maszara P 1991 Silicon-on-insulator by wafer bonding: a review J. Electrochem. Soc. 138 341-7
16. Mitani K and Gösele U 1992 Wafer bonding technology for silicon-on-insulator applications: a review J. Electron. Mater. 21 669-76
17. Gösele U, Tong Q, Schumacher A, Kräuter G, Reiche M, Plossl A, Kopperschmidt P, Lee T and Kim W 1999 Wafer bonding for microsystems technologies Sensors Actuators A 74 161-8
18. Sze S M 1981 Physics of Semiconductor Devices (New York: Wiley)
19. Grovenor CRM 1994 Microelectronic Materials (Bristol: Institute of Physics Publishing)