Placement of substrate contacts to alleviate substrate noise in epi and non-epi technologies

Midwest Symposium on Circuits and Systems

Volumn 3, Issue , 2000, Pages 1314-1319

  Secareanu, Radu M ^a   Warner, Scott ^c   Seabridge, Scott ^c   Burke, Cathie ^c   Watrobski, Thomas E ^c   Morton, Christopher ^c   Staub, William ^c   Tellier, Thomas ^c   Friedman, Eby G ^b  

^a MOTOROLA INC   (United States)

^b University of Rochester   (United States)

^c XEROX CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANALOG TO DIGITAL CONVERSION; CMOS INTEGRATED CIRCUITS; DIGITAL INTEGRATED CIRCUITS; DIGITAL TO ANALOG CONVERSION; MATHEMATICAL MODELS; NOISE GENERATORS;

MIXED SIGNAL SMART POWER CIRCUITS; SUBSTRATE NOISE;

INTEGRATED CIRCUIT LAYOUT;

EID: 0034464981     PISSN: 15483746     EISSN: None     Source Type: Journal    
DOI: 10.1109/MWSCAS.2000.951457     Document Type: Article

References (10)

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5. Voltage-comparator-based measurement of equivalent sampled substrate noise waveforms in mixed-signal integrated circuits
6. Addressing substrate coupling in mixed-mode IC’s: Simulation and power distribution synthesis
7. Noise immunity of digital circuits in mixed-signal smart power systems
8. The behavior of digital circuits under substrate noise in a mixed-signal smart-power environment
9. Thermal ink jet technology
10. Cadence design systems, Inc.