메뉴 건너뛰기




Volumn 13, Issue 4, 1997, Pages 19-23

Blending microelectronics, micromachining, and thermofluidics for a cost-effective printing device: Thermal ink jet technology

Author keywords

[No Author keywords available]

Indexed keywords

COLOR PRINTING; COST EFFECTIVENESS; LSI CIRCUITS; MICROELECTROMECHANICAL DEVICES; MICROELECTRONICS; MICROMACHINING; PRINTERS (COMPUTER); SEMICONDUCTOR DEVICE MANUFACTURE; THERMAL PRINTING;

EID: 0031186387     PISSN: 87553996     EISSN: None     Source Type: Journal    
DOI: 10.1109/101.600705     Document Type: Article
Times cited : (19)

References (6)
  • 2
    • 3643085932 scopus 로고
    • Hewlett-Packard Journal: Vol. 39, No. 5, pp.51-98, 1988.
    • (1988) Hewlett-Packard Journal , vol.39 , Issue.5 , pp. 51-98
  • 6
    • 0020127035 scopus 로고
    • Silicon as a Mechanical Material
    • K. Petersen, "Silicon as a Mechanical Material," Proc. IEEE, Vol.70, No. 5, 1982, pp. 420-457.
    • (1982) Proc. IEEE , vol.70 , Issue.5 , pp. 420-457
    • Petersen, K.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.