Experimental Results and Modeling of Noise Coupling in a Lightly Doped Substratet

Technical Digest - International Electron Devices Meeting, IEDM

Volumn , Issue , 1996, Pages 623-626

  Blalack, Tallis ^a   Lau, Jack ^b   Clement, Fraqois J R ^a   Wooley, Bruce A ^a  

^a Stanford University   (United States)

^b HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

BULK WAFERS; CIRCUIT NODES; COMPACT MODEL; EXPERIMENTAL CONFIRMATION; LAYOUT DEPENDENCES; LIGHTLY DOPED; LIGHTLY DOPED SUBSTRATES; NOISE COUPLING; SUBSTRATE COUPLINGS; SUBSTRATE NOISE COUPLING;

SUBSTRATES; INTEGRATED CIRCUIT LAYOUT;

COMPUTER SIMULATION; ELECTRIC CURRENTS; LINEAR INTEGRATED CIRCUITS; MULTIPLEXING EQUIPMENT; OSCILLATORS (ELECTRONIC); SPURIOUS SIGNAL NOISE; SUBSTRATES; TRANSISTORS; VLSI CIRCUITS;

COMPACT SUBSTRATE MODEL; LATCHUP; LIGHTLY DOPED SUBSTRATE; NOISE COUPLING;

EID: 0030386816     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEDM.1996.554060     Document Type: Conference Paper

References (3)

1. D. K. Su, M. J. Loinaz, S. Masui, and B. A. Wooley, “Experimental Results and ModelingTechniquesfor SubstrateNoise in Mixed-Signal Integrated Circuits,” IEEE J. Solid-state Circuits, vol. 28, pp. 420-430, Apr. 1993.
2. T. Blalack and B. A. Wooley, “The Effects of Switching Noise on an OversamplingN D Converter,”IEEEIntemational Solid-State Circuits Conference,pp. 200-201, Feb. 1995.
3. E J. R. Clement, E. Zysman, M. Kayal, and M. Declercq, ‘Toward a Global Solution for Parasitic Coupling Modeling and Visualization,” IEEE Custom Integrated Circuits Conference, pp. 537-540, May 1994.